Rotary telemetry system for temperature measurements in aircraft component testing

Authors

  • Tomasz Kabala Łukasiewicz Research Network – Institute of Aviation
  • Jerzy Weremczuk Warsaw University of Technology, Faculty of Electronics and Information Technology The Institute of Electronic Systems

Abstract

Aviation testing is intrinsically connected with rotary telemetry, which enables engineers to measure and verify parameters of high-speed aircraft engines components during laboratory testing. The main purpose of this article is to propose new design concept of smart telemetry module for temperature measurements, which could be easily adapted to various demands of high-speed rotary components tests and is more handful, functional and affordable than other solutions on the market. The result of the work is a telemetry system in form of light weight, PCB-based, wireless powered, smart transducer. Article presents state of art analysis, design and manufacturing steps, test results and conclusions.

Author Biographies

Tomasz Kabala, Łukasiewicz Research Network – Institute of Aviation

M.Sc. (2012) Automation and Robotics at the Faculty of Power and Aueronautical Engineering, Postgraduate studies in field of Electrical Installations (2017), Advanced Lead Control&Instrumentation Engineer in Łukasiewicz Research Network – Institute of Aviation (2013-)

Jerzy Weremczuk, Warsaw University of Technology, Faculty of Electronics and Information Technology The Institute of Electronic Systems

M.Sc. (1988), Ph.D. (2000), D.Sc. (2012); Head of Research Group on Sensors and Microsystems (2015–), IEEE Senior Member; Chairman of Instrumentation and Measurement Chapter of IEEE Poland Section (2021- , V-ce 2013–2020), Member of Polish Society of Sensor Technology (2013-), Member of the Head of Polish Society of Sensor Technology (2016-2018, 2020-), Chairman of the International Conference on Optical and Electronic Sensors COE (2018); Topic Board Editor of Sensors MDPI (2020-).

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Published

2024-04-19

Issue

Section

Sensors, Microsystems, MEMS, MOEMS